Microscale Co., Ltd.

Microscale Co., Ltd. has been established
in Feb. 2000 with a purpose of deploying its advanced flip chip bumping services
to the worldwide semiconductor industry

Microscale?s plant occupys a 4,950m2 area
  with 1,650m2 of clean room (class100/10000) and has an output of 15,000 wafers
  per month in 2001 and 50,000 wafers in 2003.

Starting with an Electro plating line for
  Au bump, Microscale will set-up a stud bumping line, a solder bumping line,
  and a PCB bumping line until 2001 to provide total bumping services to customers.

As a customer-driven business, Microscale
  considers the customer?s satistaction as the most important thing and tries
  to meet customer?s state-of-the-art needs by constant innovation and improvement
  of flip chip technology. Our future- oriented technology, know-how and personal
  commitment will meet the emerging needs for advanced packages